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Chip analysis services Samples preparation Chip processing •1. Decap chips by chemical method or some special ways for some special package types . •2. Remove layers: Remove layers by etching, including protective layer--polyimide, oxide layer, passivation layer, metal layer, etc. •3. Chip dyeing: Dye chips for easy identification, mainly includes highlighting metal layers, dyeing different kinds of wells, dyeing ROM code point. •4. Chip photograph: Take photographs of chips using SEM. •5. Piecing photographs together: Piece partial photographs together (Piecing by software, piecing by hands after developed). Circuit Analysis Cost Analysis
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