Telephone: 086-755 86168952
Fax:086-755 86168953
Address:RM1507,15rd Floor,Bldg B,TANGSHANG building,No.35 guangshen Rd,Bao\\\'an District,Shenzhen,China.
Fax:086-755 86168953
Address:RM1507,15rd Floor,Bldg B,TANGSHANG building,No.35 guangshen Rd,Bao\\\'an District,Shenzhen,China.
Current position:Home >ODM > Envelope Foundry >
1.COB technology
While welding, put chip on PCB board first, lead wire after solidification, cover with resin adhesive
after test is validated.
Features: mature technology, low cost, small size, but strict for environment, not easy to maintain
2.Flip Chip (flip chip on board)
Compared with COB ,I/O port is located on chip surface,package density and speed are improved